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Intel Core i3-8100 i3 8100 3.6 GHz Quad-Core Quad-Thread CPU Processor 6M 85W LGA 1151

Intel Core i3-8100 i3 8100 3.6 GHz Quad-Core Quad-Thread CPU Processor 6M 85W LGA 1151

Regular price €30,00 EUR
Regular price €26,12 EUR Sale price €30,00 EUR
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SPECIFICATIONS

Brand Name: Intel

Application: Desktop

Support Chipset Models: Intel H310

Processor Type: Intel Core i3

Default TDP / TDP: 65

Number OF Therads: 4

Support Memory Type: DDR4

Origin: Mainland China

Socket Type: LGA 1151

GPU-built: YES

Cooling system: no

Support Memory Channels: 2

PCIe VERSION: PCIe 3.0

Usage Scenario: others

Chip Process: 14 nanometers

Unlocked: YES

Type: Quad-Core

L3 Cache Capacity: 6

Number of Cores: Quad-Core

Package: No

L2 Cache Capacity: 1

Please read:

Second-hand product.The origin is sent randomly with a one-year warranty.Due to the production process, the surface of the product is not 100% smooth and may be accompanied by scratches.

Intel Core i3-8100 specifications


General information

Type

CPU / Microprocessor

Market segment

Desktop

Family


Intel Core i3


Model number  ? 


i3-8100

CPU part numbers


  • CM8068403377308 is an OEM/tray microprocessor

  • BX80684I38100 is a boxed processor (English version)

  • BXC80684I38100 is a boxed processor (Chinese version)

Frequency ? 

3600 MHz

Low power frequency

800 MHz

Bus speed ? 

8 GT/s DMI

Clock multiplier ? 

36

Package

1151-land Flip-Chip Land Grid Array

Socket

Socket 1151 / H4 / LGA1151

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

September 24, 2017 (announcement)
October 5, 2017 (availability)

Price at introduction

$117

S-spec numbers

Part number

ES/QS processors

Production processors


QN5K

QNET

QP5K

SR3N5

BX80684I38100




+

BXC80684I38100




+

CM8068403377308




+

Unknown

+

+

+


Architecture / Microarchitecture

Microarchitecture

Coffee Lake


Processor core  ? 

Coffee Lake-S


Core steppings  ? 

B0 (QNET, SR3N5)
U0 (QN5K, QP5K)

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

4

The number of threads

4

Floating Point Unit

Integrated


Level 1 cache size  ? 

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

4 x 256 KB 4-way set associative caches

Level 3 cache size

6 MB 12-way set associative shared cache

Physical memory

64 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

  • MMX instructions

  • SSE / Streaming SIMD Extensions

  • SSE2 / Streaming SIMD Extensions 2

  • SSE3 / Streaming SIMD Extensions 3

  • SSSE3 / Supplemental Streaming SIMD Extensions 3


  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

  • AES / Advanced Encryption Standard instructions

  • AVX / Advanced Vector Extensions

  • AVX2 / Advanced Vector Extensions 2.0

  • BMI / BMI1 + BMI2 / Bit Manipulation instructions

  • F16C / 16-bit Floating-Point conversion instructions

  • FMA3 / 3-operand Fused Multiply-Add instructions


  • EM64T / Extended Memory 64 technology / Intel 64  ? 


  • VT-x / Virtualization technology  ? 

  • VT-d / Virtualization for directed I/O

Security Features


  • NX / XD / Execute disable bit  ? 

  • MPX / Memory Protection Extensions

  • SGX / Software Guard Extensions

  • SMAP / Supervisor Mode Access Prevention

  • SMEP / Secure Mode Execution Protection

Low power features

  • Core C1/C1E, C3, C6, C7, C8, C9 and C10 states

  • Package C2, C3, C6, C7, C8, C9 and C10 states


  • Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Display controller

  • 3 displays

  • DVI / DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4

Integrated graphics

GPU Type: Intel UHD 630
Graphics tier: GT2
Microarchitecture: Gen 9 LP
Execution units: 23
Base frequency (MHz): 350
Maximum frequency (MHz): 1100

Memory controller

The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR4-2400
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 38.4
ECC supported: Yes

Other peripherals

  • Direct Media Interface 3.0 (4 lanes)

  • PCI Express 3.0 interface (16 lanes)

Electrical / Thermal parameters


Minimum/Maximum operating temperature  ? 

0°C (case temperature) - 69.9°C (case temperature)
100°C (Digital Thermal Sensor)

Thermal Design Power ? 

65 Watt

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